RAK4200 Breakout Board

Product Summary

Product Description RAK4200 Breakout Board is specifically designed to allow easy excess to the pins on the module in order to simplify development and testing.

Editorial narrative

Product Description RAK4200 Breakout Board is specifically designed to allow easy excess to the pins on the module in order to simplify development and testing. The breakout board utilized is of an Xbee form factor and its main purpose is to allow the RAK4200 stamp module form factor pinout to be transferred to 2.54mm headers. The module itself has the RAK4200 at its core, integrating an STM32L071 MCU and an SX1276 LoRa® chip. It has Ultra-Low Power Consumption of 1.5uA in sleep mode and high LoRa® output power (19dBm) in work mode. The module complies with LoRaWAN® 1.0.2 protocols. It also supports Lora® Point to Point communication. The low power, long-range LoRa® communication capabilities of the module make it suitable for a variety of applications in the IoT field such as home automation, sensor networks, building automation, personal area networks applications (health/fitness sensors and monitors, etc Key Features LoRa® module for Smart City, Smart Agriculture, Smart Industry I/O ports: UART/I2C/GPIO Frequency range: 433 to 470 MHz; 863 to 923 MHz (entire LoRa® spectrum) Low-Power Wireless Systems with 7.8kHz to 500KHz Bandwidth LoRa® Tx power up to 19dBm Ultra-Low Power Consumption 2.0µA in sleep mode Core: ARM 32-bit Cortex M0+ with MPU Up to128KB flash memory with ECC 20KB RAM 6KB of data EEPROM with ECC Supply voltage: 2.0 ~ 3.6V Temperature range: -40°C to +85°C Package Inclusions 1x RAK4200 LPWAN Breakout Module 1x LoRa® antenna with RP-SMA female connector 18x Dupont lines Documentation RAK200 Breakout Module Quick Start Guide RAK4200 Breakout Module Datasheet Become a RAK Affiliate and Earn Today! Get paid to talk about RAK products! Join the RAK Affiliate program today.

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• Last verified: 2026-06-01